Photop provides design and engineering solutions that are vertically integrated with our manufacturing, logistics, component, and functional module technologies to optimize customers' engineering, proto-typing, rampup, and operations by competitive costs and reducing time to market.
Leveraging Photop's extensive design and engineering capability from photonic materials to optical fabrication, micro optics to fiberoptics components and function optical modules, optical parts to optical assembly, display key components and laser, passive to active assemblies, Photop not only supplies diverse ranges of products to our customers, but also provides optimized design solutions to your product development, contract manufacturing, and technical transfer projects.
With our experienced and skillful teams, Photop provides:
TO-can, Butterfly Packaging; and Seam Sealing for Laser, Transceiver, and EO Modules
Vertical Integration of Optics, Mechanics and Electronics
State-of-art Thin Film Coating capabilities with IAD, EB, IBS & MS Technologies
All-glass & Lead-free Soldering Packaging for Optical Components and Modules
Glass to Metal Sealing (GTMS)
Worldwide Quick Turn Service